Warpage of Plastic IC Packages as a Function of Processing Conditions

[+] Author and Article Information
Dickson T. S. Yeung, Matthew M. F. Yuen

Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

J. Electron. Packag 123(3), 268-272 (Dec 22, 1999) (5 pages) doi:10.1115/1.1349421 History: Received December 22, 1999
Copyright © 2001 by ASME
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Grahic Jump Location
Degree-of-cure as a function of Tg
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Tg Dependence of α1 and α2
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Quarter finite element model of a PQFP
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Quarter model showing leadframe and die of the package
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Warped package with alloy 42 leadframe
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Warped package with copper leadframe
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Warpage prediction of PQFP with A42 leadframe against processing conditions, (a) Viscoelatic EMC model, (b) Elastic EMC model
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Processing window of warpage prediction
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Warpage measurement, (a) Fixture for measurement, (b) Measured package profile



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