A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads

[+] Author and Article Information
Kuo-Ning Chiang

Department of Power Mechanical Engineering, National Tsing Hua University, 101, Sec. 2, Kuang-Fu Rd., HsinChu Taiwan 300e-mail: knchiang@pme.nthu.edu.tw

Chang-Ming Liu

Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan 300

J. Electron. Packag 123(2), 127-131 (Aug 19, 1999) (5 pages) doi:10.1115/1.1339196 History: Received August 19, 1999
Copyright © 2001 by ASME
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Round pad and reflow shape
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(a) Typical solder reflow shape (side view) with elliptical pad; (b) typical solder reflow shape (side view) with round pad
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A typical elliptical pad geometry and solder reflow shape
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Wireability of BGA substrate
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Mesh density versus gravitational restoring forces (compression/tension loading)
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Apply same loading condition to three different axis direction
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Failure distribution results for TBGA devices constructed with different solder ball pad sizes
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(a) Round pad standoff height versus elliptical pad standoff height; (b) round pad contact angle versus elliptical pad contact angle
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The finite element model of a typical PBGA structure
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37 percent Pb/63 percent Sn eutectic solder temperature dependent stress/strain curve
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A typical layout of elliptical pads for viperBGA packaging



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