A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate

[+] Author and Article Information
C. Y. Hui, H. D. Conway, Y. Y. Lin

Department of Theoretical and Applied Mechanics, Cornell University, Ithaca, NY 14853

J. Electron. Packag 122(3), 267-273 (Sep 01, 2000) (7 pages) doi:10.1115/1.1287930 History:
Copyright © 2000 by ASME
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Frank,  F. C., and Van Der Merwe,  J. H., 1949, “One Dimensional Dislocation II. Misfitting Monolayers and Oriented Overgrowth,” Proc. R. Soc. London Series A, 198, pp. 216–225.
Doerner,  F. M., and Nix,  D. W., 1988, “Stresses and Deformation Processes in Thin Films on Substrates,” CRC Crit. Rev. Solid State Mater. Sci., 14, No. 13, pp. 225–268.
Nix,  W. D., 1989, “Mechanical Properties of Thin Films,” Metall. Trans., 20A, pp. 2217–2245.
Thouless,  M. D., Olsson,  E., and Gupta,  A., 1992, “Cracking of Brittle Films on Elastic Substrates,” Acta Metall. Mater., 40, No. 6, pp. 1287–1292.
Thouless,  M. D., Hutchinson,  J. W., and Liniger,  E. G., 1992, “Plane-Strain, Buckling-Driven Delamination of Thin Films: Model Experiments and Mode II Fracture,” Acta Metall. Mater., 40, No. 10, pp. 2639–2649.
Evans,  A. G., and Hutchinson,  J. W., 1994, “On the Mechanics of Delamination and Spalling in Compressed Films,” Int. J. Solids Struct., 20, No. 5, pp. 455–466.
Drory,  D. M., and Evan,  A. G., 1990, “Experimental Observations of Substrate Fracture Caused by Residual Stressed Films,” J. Am. Ceram. Soc., 73, No. 3, pp. 634–638.
Evans,  A. G., and Hu,  M. S., 1989, “The Cracking and Decohesion of Thin Films on Ductile Substrates,” Acta Metall., 37, No. 3, pp. 917–925.
Hu,  M. S., Thouless,  M. D., and Evans,  A. G., 1988, “The Decohesion of Thin Films from Brittle Substrates,” Acta Metall., 36, No. 5, pp. 1301–1307.
Hutchinson,  J. W., and Suo,  Z., 1992, “Mixed Mode Cracking in Layered Materials,” Adv. Appl. Mech., 29, pp. 63–191.
Jiao,  J., Gurumurthy,  C. K., Kramer,  E. J., Sha,  Y., Hui,  C. Y., and Borgesen,  P., 1998, “Measurement of Interfacial Fracture Toughness under Combined Mechanical and Thermal Stresses,” ASME J. Electron. Packag., 120, pp. 349–353.
Doerner,  F. M., Gardner,  D. S., and Nix,  D. W., 1986, “Plastic Properties of Thin Films on Substrates as Measured by Submicron and Substrate Curvature Techniques,” J. Mater. Res., 1, No. 6, pp. 845–851.
Thouless,  M. D., Gupta,  J., and Harper,  J. M. E., 1993, “Stress Development and Relaxation in Copper Films During Thermal Cycling,” J. Mater. Res., 8, No. 6, pp. 1845–1852.
Dempsey,  J. P., and Sinclair,  G. B., 1979, “On the Stress Singularities in the Plane Elasticity of the Composite Wedge,” J. Elast., 9, pp. 373–391.
Bogy,  D. B., 1971, “Two Edge-Bonded Elastic Wedges of Different Materials and Wedge Angles Under Surface Tractions,” ASME J. Appl. Mech., 94, pp. 377–386.
Stoney,  G. G., 1909, “The Tension of Metallic Films Deposited by Electrolysis,” Proc. Roy. Soc. London A Math., 82, pp. 172–175.
Liu,  X. H., Suo,  Z., and Ma,  Q., 1998, “Split Singularities: Stress Field Near the Edge of Silicon Die on Polymer Substrate,” Acta Metall., 47, No. 1, pp. 67–76.
Suo,  Z., and Hutchinson,  J. W., 1990, “Interface Cracks Between Two Elastic Layers,” Int. J. Fract., 43, pp. 1–18.
Suo,  Z., and Hutchinson,  J. W., 1989, “Steady-State Cracking in Brittle Substrate Beneath Adherent Films,” Int. J. Solids Struct., 25, No. 11, pp. 1337–1353.


Grahic Jump Location
Geometry of two-layer system
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Schematic of internal stresses in composite
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Schematic of final stress state as superposition of two stress states
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Polar coordinate system for the analysis of local stress state near the edge
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Shear and normal stresses at ends of composite. These stresses are statically equivalent to the force F and moment M.
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Free body diagram of film and substrate
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(a) Comparison of film stresses (40) with those obtained from Stoney formula (14b). ω=Ef/Es and δ=hf/hs. (b) Comparison of film stresses (13b) with those obtained from Stoney formula (14b). ω=Ef/Es and δ=hf/hs.
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Elastic-plastic behavior of film material
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Schematic of energy release rate calculation
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Propagation of interface crack into substrate



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