Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

[+] Author and Article Information
J. R. Culham, M. M. Yovanovich

Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering, University of Waterloo, Waterloo, Canada

T. F. Lemczyk

Louisiana State University, Baton Rouge, LA 70821

J. Electron. Packag 122(3), 233-239 (Sep 01, 2000) (7 pages) doi:10.1115/1.1287928 History:
Copyright © 2000 by ASME
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Multiple layer substrate
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Various package geometries reproduced from sketches in Bar-Cohen 11
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Coordinate system for package model
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Die plane control surfaces; (a) single source, (b) multiple sources
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Conductive and radiative heat transfer paths in an open cavity package
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Profiles of packages used for model validation; (a) validation chip module, (b) 208 pin plastic quad flat pack, (c) cavity up multichip module



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