Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

[+] Author and Article Information
Dickson T. S. Yeung, David C. C. Lam, Matthew M. F. Yuen

Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

J. Electron. Packag 122(1), 67-72 (Dec 09, 1999) (6 pages) doi:10.1115/1.483137 History: Received October 28, 1999; Revised December 09, 1999
Copyright © 2000 by ASME
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Cao,  H. C., and Evans,  A. G., 1989, “An Experimental Study of The Fracture Resistance of Bimaterial Interface,” Mech. Mater., 7, pp. 295–304.
Charalambides,  P. G., , 1989, “A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces,” ASME J. Appl. Mech., 56, pp. 77–82.
Charalambides,  P. G., , 1990, “Development of a Test Method for Measuring the Mixed Mode Fracture Resistance of Bimaterial Interfaces,” Mech. Mater., 8, pp. 269–283.
Wang,  J.-S., 1995, “Interfacial Fracture Toughness of a Copper/Alumina System and The Effect of Loading Phase Angle,” Mech. Mater., 20, pp. 251–259.
Wang,  J.-S., and Suo,  Z., 1990, “Experimental Determination of Interfacial Toughness Curves Using Brazil-Nut-Sandwiches,” Acta Metall. Mater., 38, No. 7, pp. 1279–1290.
Yeung, T. S., et al., 1999, “Determination of Interfacial Fracture Properties for Electronics Materials,” to be published.
Williams,  M. L., 1959, “The Stresses Around a Fault or Crack in Dissimilar Media,” Bull. Seismol. Soc. Am., 49, pp. 199–204.
Rice,  J. R., 1988, “Elastic Fracture Mechanics Concepts for Interfacial Cracks,” ASME J. Appl. Mech., 55, pp. 98–103.
Dundurs,  J., 1969, “Edge-Bonded Dissimilar Orthogonal Elastic Wedges,” ASME J. Appl. Mech., 36, pp. 650–652.
Hutchinson,  J. W., and Suo,  Z., 1992, “Mixed Mode Cracking in Layered Materials,” Adv. Appl. Mech., 29, pp. 63–191.
Matos,  P. P. L., , 1989, “A Method for Calculating Stress Intensities in Bimaterial Fracture,” Int. J. Fract., 40, pp. 235–254.


Grahic Jump Location
GSS as a function of h1 and h1/h3
Grahic Jump Location
GSS as a function of h2 and h2/h3
Grahic Jump Location
GSS as a function of h3 and h2/h3
Grahic Jump Location
(a) GSS as a function of thickness ratio; (b) |GSS| as a function of thickness ratio
Grahic Jump Location
Various test specimens for measuring interfacial fracture resistance: (a) brazil-nut-sandwich; (b) symmetric double cantilever beam; (c) asymmetric double cantilever beam; (d) end-notched flexure; and (e) center cracked beam (CCB).
Grahic Jump Location
Interfacial crack tip region
Grahic Jump Location
Half model of a four-layer CCB specimen
Grahic Jump Location
Equivalent model (formulation by superposition)
Grahic Jump Location
GSS as a function of E3 and E2/E3
Grahic Jump Location
(a) GSS as a function of modulus ratio; (b) |GSS| as a function of modulus ratio



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