Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens

[+] Author and Article Information
W. Ren, Z. Qian, M. Lu, S. Liu

Electronic Packaging Laboratory, Department of Mechanical Engineering, Wayne State University, Detroit, MI 48202

D. Shangguan

Visteon Automotive Systems, Ford Motor Company, Dearborn, MI 48121-6010

J. Electron. Packag 121(4), 271-274 (Dec 01, 1999) (4 pages) doi:10.1115/1.2793851 History: Received January 01, 1998; Revised May 03, 1999; Online November 05, 2007


The thermomechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep, and fatigue, are carried out on a computer controlled 6-axis mini-fatigue tester. The thin strip specimen is used in this research, which is specially designed and verified to be suitable for the testing of solder alloys and comparable to the data from the literature. Based on the experimental study, the new lead free solder alloy shows very attractive characteristics and may have potential applications in electronics packaging products.

Copyright © 1999 by The American Society of Mechanical Engineers
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