Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

[+] Author and Article Information
J. Lau, T. Chen, S.-W. R. Lee

Express Packaging Systems, Inc., 1137-B San Antonio Road, Palo Alto, CA 94303

J. Electron. Packag 121(4), 242-248 (Dec 01, 1999) (7 pages) doi:10.1115/1.2793847 History: Received September 15, 1998; Revised May 27, 1999; Online November 05, 2007


The effect of heat-spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost-effective cavity-down plastic ball grid array (PBGA) packages assembled on a FR-4 epoxy glass printed circuit board (PCB) is presented. The sizes of these packages are 35 × 35 mm and 40 × 40 mm with 4 and 5 rows of solder balls.

Copyright © 1999 by The American Society of Mechanical Engineers
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