Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions

[+] Author and Article Information
H. Chai, Y. Zohar

Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

J. Electron. Packag 121(3), 137-142 (Sep 01, 1999) (6 pages) doi:10.1115/1.2792675 History: Received March 24, 1997; Revised April 26, 1999; Online November 05, 2007


Wire sweep has been recognized as a critical process defect which can result in device failure. The phenomenon is very complicated as it is sensitive to a large number of parameters. In this experimental work, the influence of some of the more important factors is investigated. These parameters include fluid-flow speed, wire-bond density, mold cavity height, and mold vent size. A 160L QFP package bonded with gold wires in a transparent mold is used as the test vehicle.

Copyright © 1999 by The American Society of Mechanical Engineers
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