Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

[+] Author and Article Information
L. Tang

Power and Packaging, FORE Systems, 1000 Fore Drive, Warrendale, PA 15086

Y. K. Joshi

CALCE Electronic Products and Systems Consortium, and Department of Mechanical Engineering, University of Maryland, College Park, MD 20742

J. Electron. Packag 121(2), 108-115 (Jun 01, 1999) (8 pages) doi:10.1115/1.2792664 History: Received September 08, 1997; Revised March 09, 1998; Online November 05, 2007


In the present paper, a methodology is described for the integrated thermal analysis of a laminar natural convection air cooled nonventilated electronic system. This approach is illustrated by modeling an enclosure with electronic components of different sizes mounted on a printed wiring board. First, a global model for the entire enclosure was developed using a finite volume computational fluid dynamics/heat transfer (CFD/CHT) approach on a coarse grid. Thermal information from the global model, in the form of board and component surface temperatures, local heat transfer coefficients and reference temperatures, and heat fluxes, was extracted. These quantities were interpolated on a finer grid using bilinear interpolation and further employed in board and component level thermal analyses as various boundary condition combinations. Thus, thermal analyses at all levels were connected. The component investigated is a leadless ceramic chip carrier (LCCC). The integrated analysis approach was validated by comparing the results for a LCCC package with those obtained from detailed system level thermal analysis for the same package. Two preferred boundary condition combinations are suggested for component level thermal analysis.

Copyright © 1999 by The American Society of Mechanical Engineers
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