Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory

[+] Author and Article Information
C. Basaran

Electronic Packaging Laboratory, State University of New York at Buffalo, Buffalo, NY 14260

R. Chandaroy

HKS ABAQUS Inc., Detroit, MI

J. Electron. Packag 121(1), 8-11 (Mar 01, 1999) (4 pages) doi:10.1115/1.2792663 History: Received March 05, 1998; Revised April 26, 1998; Online November 05, 2007


Solder joints are commonly used in surface mount technology microelectronics packaging. It is well known that the dominant failure mode for solder joints is thermal fatigue. When semiconductor devices are used in a vibrating environment, such as in automotive and military applications, dynamic stresses contribute to the failure mechanism and in certain circumstances they can become the dominant failure cause. In this paper a unified constitutive model for Pb40/Sn60 solder joints is developed and then implemented in a finite element dynamic analysis procedure. The purpose of the material model and the implementation is to study the contribution of vibration induced strains to the fatigue life of solder interconnects in low cycle and high cycle fatigue. The proposed material model, which is based on the disturbed state concept (DSC), is used for a dynamic analysis of a solder joint in the following paper, Part II, Basaran and Chandaroy (1998).

Copyright © 1999 by The American Society of Mechanical Engineers
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