Potential Failure Sites in a Flip-Chip Package With and Without Underfill

[+] Author and Article Information
E. Madenci, S. Shkarayev

Department of Aerospace and Mechanical Engineering, The University of Arizona, Tucson, AZ 85726

R. Mahajan

Intel Corporation, Chandler, AZ 85226

J. Electron. Packag 120(4), 336-341 (Dec 01, 1998) (6 pages) doi:10.1115/1.2792643 History: Received April 20, 1998; Revised August 08, 1998; Online November 06, 2007


In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global elements capture the exact singular behavior of the stresses near the geometric and material discontinuities. Application of the strain energy density criterion indicates the possible failure sites and how they shift due to the presence of underfill.

Copyright © 1998 by The American Society of Mechanical Engineers
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