Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

[+] Author and Article Information
H. Doi, K. Kawano, A. Yasukawa

Mechanical Engineering Research Laboratory, Hitachi, Ltd., 502 Kandatsu, Tsuchiura, Ibaraki, 300-0013, Japan

T. Sato

Device Development Center, Hitachi, Ltd., 2326 Imai, Ome, Tokyo, 198-0023, Japan

J. Electron. Packag 120(4), 322-327 (Dec 01, 1998) (6 pages) doi:10.1115/1.2792641 History: Received February 06, 1998; Revised July 23, 1998; Online November 06, 2007


The effect of a heat spreader on the life of the solder joints for underfill-encapsulated, flip-chip packages is investigated through stress analyses and thermal cycling tests. An underfill with suitable mechanical properties is found to be able to prolong the fatigue life of the solder joints even in a package with a heat spreader and an alumina substrate. The delamination of the underfill from the chip is revealed as another critical failure mode for which the shape of the underfill fillet has a large effect.

Copyright © 1998 by The American Society of Mechanical Engineers
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