Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint

[+] Author and Article Information
A. F. Elkouh, N. Ramasubramanian, T. F. Hsu, N. J. Nigro, S. M. Heinrich

Marquette University, 1515 W. Wisconsin Avenue, Milwaukee, WI 53233

P. S. Lee

Rockwell Automation, 1201 S. Second Street, Milwaukee, WI 53204

D. Shangguan

Ford Motor Company, Electronics Division, Dearborn, MI 48121

J. Electron. Packag 119(4), 268-274 (Dec 01, 1997) (7 pages) doi:10.1115/1.2792248 History: Received August 19, 1996; Revised May 30, 1997; Online November 06, 2007


Solutions for axisymmetric profiles of solder joints formed between a cylindrical pin and a printed circuit board (PCB) are presented. The dimensionless differential equation governing the formation of the solder joints is developed and then solved numerically for the cases of single upright joints, single inverted joints, and through-hole joints. Results are presented in terms of the following dimensionless parameters: bond number, solder volume, board thickness, and tinning radius. The dimensionless approach makes the results from this study suitable for use in a broader range of applications.

Copyright © 1997 by The American Society of Mechanical Engineers
Topics: Solders , Geometry
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