The Impact of Interfacial Adhesion on PTH and Via Stress State

[+] Author and Article Information
G. Subbarayan

Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309-0427

K. Ramakrishna

Advanced Interconnect Systems Laboratories, Semiconductor Products Sector, Motorola, Inc., Austin, TX 78730

B. G. Sammakia

Materials Science, Endicott Electronic Packaging, Microelectronics Division, IBM Corporation, Endicott, NY 13760

J. Electron. Packag 119(4), 260-267 (Dec 01, 1997) (8 pages) doi:10.1115/1.2792247 History: Received September 01, 1995; Revised August 20, 1996; Online November 06, 2007


In this paper the impact of the state of barrel-laminate adhesion on the PTH and via stresses is investigated. A representative PTH and a representative blind via in a printed wiring board are used as demonstration vehicles. Transient heat conduction and nonlinear elastic-plastic-contact finite element analyses are carried out on PTHs and vias under the extreme conditions of perfect and zero barrel-laminate adhesion. In general, the maximum equivalent plastic strains in PTHs and vias with strong barrel-laminate adhesion are not large enough to fracture the plating. Fracture is possible at or near the innerplane junction when barrel-laminate adhesion is lost. The possibility of plating fracture in a blind via is strongly dependent on the tolerances in manufacturing process parameters such as drill depth and laminate thickness.

Copyright © 1997 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In