Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

[+] Author and Article Information
S. Han, K. K. Wang

Cornell Injection Molding Program, Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, NY 14853

D. L. Crouthamel

Bell Laboratories, Lucent Technologies, Allentown, PA

J. Electron. Packag 119(4), 247-254 (Dec 01, 1997) (8 pages) doi:10.1115/1.2792245 History: Received May 01, 1995; Revised November 01, 1996; Online November 06, 2007


In this study, the wire-sweep problem has been studied by performing experiments using a commercial-grade epoxy molding compound, a real chip assembly, and an industrial encapsulation process. After encapsulating the chip, the deformed wire shape inside the plastic package has been determined by X-ray scanning. A procedure for the wire-sweep calculation during encapsulation process has been developed. The wire sweep values have been calculated using this procedure with material properties measured from experiments. The calculated wire-sweep values are compared with experimental values measured at different mold temperatures, fill times, and cavities. In most cases, the calculated values are in good agreement with the experimental values.

Copyright © 1997 by The American Society of Mechanical Engineers
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