Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package

[+] Author and Article Information
J. H. Lau, K.-L. Chen

Express Packaging Systems Inc., Palo Alto, CA 94303

J. Electron. Packag 119(3), 208-212 (Sep 01, 1997) (5 pages) doi:10.1115/1.2792236 History: Received July 15, 1996; Revised March 01, 1997; Online November 06, 2007


The temperature distribution and thermal resistance of a facedown PBGA (Plastic Ball Grid Array) package assembled on a FR-4 epoxy glass PCB (Printed Circuit Board) are presented. By varying the thickness of the copper heat spreader and organic substrate, an optimum PBGA package is designed. The effect of power and ground planes in the PCB and the size of PCB on the thermal performance of the PBGA is also given. Furthermore, the warpage (deflection) of the package under thermal loading is predicted.

Copyright © 1997 by The American Society of Mechanical Engineers
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