Effect of Load-Mix on Fatigue Crack Growth in 63Sn-37Pb Solder Joints

[+] Author and Article Information
D. Yao, J. K. Shang

Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801

J. Electron. Packag 119(2), 114-118 (Jun 01, 1997) (5 pages) doi:10.1115/1.2792212 History: Received January 01, 1996; Revised April 01, 1996; Online November 06, 2007


Fatigue crack growth at the interface between Sn-Pb solder and Cu was examined under various mixed-mode conditions. The load-mix, in terms of the ratio of Mode-II to Mode-I stress intensities, was systematically changed by varying the thickness ratio of Cu layers in the flexural-peel specimens made from Sn-Pb/Cu joints. Fatigue crack growth experiments were conducted using a sinusoidal waveform at a frequency of 5 Hz and a load-ratio of zero. Fatigue crack growth rates were measured as a function of the total strain energy release rates for a given load-mix. Fatigue crack growth resistance was found to increase with the load-mix, with the effect of the load-mix being more pronounced in the near-threshold regime. The effect of the load-mix on fatigue crack growth is shown to result from shear-enhanced frictional sliding of fatigue crack surfaces.

Copyright © 1997 by The American Society of Mechanical Engineers
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