Optimal Three-Dimensional Placement of Heat Generating Electronic Components

[+] Author and Article Information
M. I. Campbell, C. H. Amon, J. Cagan

Department of Mechanical Engineering and Engineering Design Research Center, Carnegie Mellon University, Pittsburgh, PA 15213-3890

J. Electron. Packag 119(2), 106-113 (Jun 01, 1997) (8 pages) doi:10.1115/1.2792210 History: Revised August 01, 1996; Online November 06, 2007


This work introduces an algorithm that uses simulated annealing to perform electronic component layout while incorporating constraints related to thermal performance. A hierarchical heat transfer analysis is developed which is used in conjunction with the simulated annealing algorithm to produce final layout configurations that are densely packed and operate within specified temperature ranges. Examples of three-dimensional component placement test cases are presented including an application to embedded wearable computers.

Copyright © 1997 by The American Society of Mechanical Engineers
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