Micro Heat Exchangers Consisting of Pin Arrays

[+] Author and Article Information
Xiaoqing Yin, H. H. Bau

Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania, Philadelphia, PA 19104-6315

J. Electron. Packag 119(1), 51-57 (Mar 01, 1997) (7 pages) doi:10.1115/1.2792200 History: Received January 01, 1996; Revised October 05, 1996; Online November 06, 2007


The performance of micro heat exchangers fabricated on silicon wafers and consisting ofpin arrays and straight channels is evaluated theoretically using three-dimensional numerical simulations. The coolant is liquid nitrogen and the objective is to maintain the wafer’s temperature below 90K so as to facilitate the use of high temperature superconductor interconnects in multichip modules. Both developing and periodic flows are considered. Comparisons of the performance of various geometric configurations are presented It is demonstrated that by proper selection of the heat of the heat exchanger’s geometry, the thermal resistance can be minimized.

Copyright © 1997 by The American Society of Mechanical Engineers
Topics: Heat exchangers
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