Ball Grid Array Thermomechanical Response During Reflow Assembly

[+] Author and Article Information
T. E. Voth

Thermal Sciences Department, Sandia National Laboratories, Albuquerque, NM 87185–0835

T. L. Bergman

Department of Mechanical Engineering, The University of Connecticut, Storrs, CT 06269–3139

J. Electron. Packag 118(4), 214-222 (Dec 01, 1996) (9 pages) doi:10.1115/1.2792155 History: Received May 15, 1995; Revised April 01, 1996; Online December 05, 2007


The thermomechanical response of ball-grid array assemblies during reflow soldering is considered here. Experiments are performed to investigate the thermomechanical response of a representative system and the results are used to validate a numerical model of system behavior. The conclusions drawn from the experimental studies are used to guide development of a process model capable of describing more realistic BGA soldering scenarios. Process model predictions illustrate the system’s thermomechanical response to thermal and mechanical processing conditions, as well as component properties. High thermal conductivity assemblies show the greatest sensitivity to mechanical loading conditions.

Copyright © 1996 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In