Analysis and Modeling of Lead Coplanarity Distributions

[+] Author and Article Information
E. K. Buratynski

Bell Laboratories, Lucent Technologies, Princeton, New Jersey

J. Electron. Packag 118(4), 201-205 (Dec 01, 1996) (5 pages) doi:10.1115/1.2792153 History: Received October 01, 1995; Revised August 01, 1996; Online December 05, 2007


Lead coplanarity is defined as the height of a packaged device lead above the seating plane on which the device rests. The yield of a mass reflow surface mount soldering assembly process depends on lead coplanarity since, clearly, an excessive coplanarity is likely to produce an “open” between the lead and circuit pad. Furthermore, even if a marginal joint is obtained, excessive coplanarity can lead to reliability problems. Since these issues become more important as lead sizes decrease and pitches are refined, it is important to achieve a better understanding of coplanarity. This report analyzes the nature of 86,016 coplanarity measurements of 0.4 mm pitch, 256 I/O QFP devices. Four components to the coplanarity are identified and the distribution of each is modeled. When the four components are recombined, the result is a probability distribution for coplanarity. This information is required as input to an assembly yield model where parameter variations and tolerances are analyzed to predict surface mount yields.

Copyright © 1996 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In