Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity

[+] Author and Article Information
Hiromasa Ishikawa, Katsuhiko Sasaki, Ken-ichi Ohguchi

Department of Mechanical Engineering II, Hokkaido University, Sapporo 060 Japan

J. Electron. Packag 118(3), 164-169 (Sep 01, 1996) (6 pages) doi:10.1115/1.2792147 History: Received January 01, 1996; Revised April 01, 1996; Online November 06, 2007


This paper treats the prediction of fatigue life of 60Sn-40Pb solder alloy using the plastic strain work density per unit time calculated from the proposed constitutive model for cyclic viscoplasticity. At first, in order to verify the applicability of the proposed constitutive model to the deformation of 60Sn-40Pb solder alloy, a series of basic experiments, such as creep tests and cyclic tension-compression loading tests are performed at 303K, 323K, 343K. Then, the proposed constitutive model is used to predict fatigue failure of the solder alloy. As a result, it is clarified that the proposed constitutive model is applicable to explain the viscous deformation of the solder alloy, and that its fatigue failure can be predicted using the plastic strain work density per unit time.

Copyright © 1996 by The American Society of Mechanical Engineers
Topics: Fatigue , Solders , Failure
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