Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

[+] Author and Article Information
B. Han

Mechanical Engineering Department, Clemson University, Clemson, SC 29634

Y. Guo, C. K. Lim, D. Caletka

IBM Microelectronics Division, IBM Corporation, Endicott, NY 13760

J. Electron. Packag 118(3), 157-163 (Sep 01, 1996) (7 pages) doi:10.1115/1.2792146 History: Received January 01, 1996; Revised April 01, 1996; Online November 06, 2007


Verified/predictive modeling has become an integral part of electronic packaging product development in order to reduce costs and cycle time. In this paper, interferometric displacement measurement methods are utilized to verify the validity of numerical models for microelectronics packaging design. Three optical methods with submicron sensitivities are employed: moiré interferometry, microscopic moiré interferometry and Twyman/Green interferometry. The first two provide contour maps of in-plane displacement fields, and the third maps out-of-plane displacement fields. Their high sensitivity and high spatial resolution make them ideally suited for verification of numerical models. By combining numerical modeling and experimental verification until the results merge, numerical models become more accurate and dependable. Then, the models can be applied extensively to optimize the package designs with confidence that the models provide effective information on material and geometry sensitivity.

Copyright © 1996 by The American Society of Mechanical Engineers
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