A Procedure for Automated Shape and Life Prediction in Flip-Chip and BGA Solder Joints

[+] Author and Article Information
G. Subbarayan

Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, Department of Mechanical Engineering, University of Colorado, Boulder, CO 80309

J. Electron. Packag 118(3), 127-133 (Sep 01, 1996) (7 pages) doi:10.1115/1.2792142 History: Received January 01, 1996; Revised April 01, 1996; Online November 06, 2007


In this paper, a three-dimensional shape prediction model and a finite element solution procedure for flip-chip and BGA solder joints are developed. The developed system is capable of calculating the solder joint geometry and the fatigue life automatically without any intervention from the user. The automation achieved will enable fast reliability estimation and improved accuracy, since the two-dimensional finite element mesh used for solder shape prediction is used to generate the three-dimensional finite element mesh for stress analysis. The implementation of the procedure is verified using the solution for a flip-chip joint from literature, and the capability of the code is demonstrated on a hypothetical three-dimensional solder joint with square pads that are rotated with respect to each other, and offset from each other. The system developed in the study represents the first instance of an integrated, automated finite element procedure for both shape and fatigue life prediction in general three-dimensional solder joints. The automation achieved in the system enables fast reliability estimation in a design environment, and the optimal design of flip-chip and BGA solder joint configurations for maximum life.

Copyright © 1996 by The American Society of Mechanical Engineers
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