An Empirical Crack Propagation Model and its Applications for Solder Joints

J. Electron. Packag 118(2), 104-107 (Jun 01, 1996) (4 pages) doi:10.1115/1.2792128 History: Received April 20, 1995; Revised February 15, 1996; Online November 06, 2007


This paper investigates a strain based crack propagation model, and discusses the application of fracture mechanics approach in the reliability validation of leadless solder joints. The model includes the creep effect at different temperatures and hold times, and correlates well the thermal cycling test of 90 Pb/10 Sn joints. By apply this model, an engineering method to develop the inspection criteria in accelerated reliability validation tests of leadless solder joints is proposed.

Copyright © 1996 by The American Society of Mechanical Engineers
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