Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards

[+] Author and Article Information
John Lau

Express Packaging Systems, Inc., 1137-B San Antonio Rd, Palo Alto, CA 94303

Eric Schneider, Tom Baker

Hewlett-Packard Company, 113111 Chinden Blvd, Boise, ID 83714

J. Electron. Packag 118(2), 101-104 (Jun 01, 1996) (4 pages) doi:10.1115/1.2792127 History: Received August 01, 1995; Revised January 01, 1996; Online November 06, 2007


The reliability of solder bumped flip chips on organic coated copper (OCC) printed circuit board (PCB) has been studied by shock and vibration tests and a mathematical analysis. Two different chip sizes (7 mm and 14 mm on a side) have been studied, and the larger chips have many internal solder bumps. For the in-plane and out-of-plane and out-of-plane shock tests, the chips were assembled with and without underfill encapsulants. However, for the out-of-plane vibration tests all the chips were underfilled with epoxy.

Copyright © 1996 by The American Society of Mechanical Engineers
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