Non-Fourier Heat Conduction in IC Chip

[+] Author and Article Information
Zeng-Yuan Guo, Yun-Sheng Xu

Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China

J. Electron. Packag 117(3), 174-177 (Sep 01, 1995) (4 pages) doi:10.1115/1.2792088 History: Received August 08, 1992; Revised April 12, 1995; Online November 06, 2007


Instead of the classic Fourier equation based on diffusion, a hyperbolic equation based on a wave model has been used to predict the rapid transient heat conduction in IC chips. The peak temperature, spatial difference, and time variation of temperature, which are critical to thermal reliability of the chip, are given and compared with that obtained from the Fourier equation. Analytical and numerical results show that non-Fourier effects, including the higher peak temperature and thermal stress, greater temperature difference between components, and stronger thermal noise, are significant to IC chip reliability.

Copyright © 1995 by The American Society of Mechanical Engineers
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