On Murphy’s Integrated Circuit Yield Integral

[+] Author and Article Information
John H. Lau

Hewlett-Packard Company, 1501 Page Mill Road, Palo Alto, CA 94304

J. Electron. Packag 117(2), 159-164 (Jun 01, 1995) (6 pages) doi:10.1115/1.2792084 History: Received August 01, 1994; Revised March 31, 1995; Online November 06, 2007


An approximated closed-form integrated circuit (IC) yield formula based on a Gaussian defect density distribution for the compounder in Murphy’s yield integral is presented. Also, a closed-form solution for the average number of faults (AD0 ) in an IC is obtained for a given IC yield (Y). Furthermore, based on the new IC yield formula a simple equation for determining the number of yielded chips in a wafer is given. Finally, the multichip module yield (Ym ) and resultant shipped multichip module yield (Yms ) based on the new IC yield formula are provided.

Copyright © 1995 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In