Comparison of LCC Solder Joint Life Predictions With Experimental Data

[+] Author and Article Information
Liang-chi Wen, Ronald G. Ross

Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA 91109

J. Electron. Packag 117(2), 109-115 (Jun 01, 1995) (7 pages) doi:10.1115/1.2792076 History: Received August 01, 1994; Revised March 31, 1995; Online November 06, 2007


The ability of solder joint life-prediction algorithms to predict the failure of solder joints due to temperature-cycling induced creep-fatigue has been investigated using representative leadless chip carriers (LCCs) as the test vehicle. Four different algorithms are assessed: the classic Coffin-Manson algorithm, a modified Coffin-Manson algorithm with dependency on peak stress, and two strain-energy based algorithms. JPL’s special purpose nonlinear finite element computer program was used to dynamically simulate the solder joint response to the standard NASA temperature cycling environment, which ranges from −55°C to +100°C with a 4-hour period. The computed stress-strain history provided the inputs needed by each of the failure algorithms. To test the accuracy of the analytical predictions, three different sizes of LCCs (68 pins, 28 pins, and 20 pins) were subjected to an experimental test program using the same 4-hour temperature cycle as used in the analytical predictions. The three different sized ceramic packages, each with a 50-mil pitch, provided a range of cyclic strain ranges and solder fillet geometries so as to test the algorithms against realistic electronic packaging variables. The study highlights limitations in the historical Coffin-Manson relationship, and points up possible improvements associated with incorporating a stress modifier into the Coffin-Manson equation. This modification is also somewhat simpler and more accurate than the energy-density based algorithms, which also performed quite well.

Copyright © 1995 by The American Society of Mechanical Engineers
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