Undercooling of 63SN-37PB Solder Pastes

[+] Author and Article Information
Zequn Mei

Electronic Assembly Development Center, Hewlett-Packard Company, Palo Alto, CA

J. Electron. Packag 117(2), 105-108 (Jun 01, 1995) (4 pages) doi:10.1115/1.2792075 History: Received August 01, 1994; Revised March 31, 1995; Online November 06, 2007


Large-scale undercoolings and long incubation periods for solidification of 63Sn-37Pb solder pastes were observed through a differential scanning calorimeter, as functions of cooling rate and contact surface (aluminium versus copper). The undercooling reduced significantly with decreased cooling rate, but even at a rate of 2°C/minute, the undercooling was as large as 35°C for a no-clean solder paste in an aluminium sample pan. Poor wetting conditions (weak flux, nonwetting surfaces) led to large undercoolings and long incubation periods. The undercooling during a typical reflow process in electronic assembly was determined, by a simulated DSC test, to be about 50°C for a no-clean solder paste on bare copper surface. The large undercooling is probably caused by the reduced degree of the heterogeneous nucleation for solidification due to the small size of a solder joint and poor wetting with its contact surface.

Copyright © 1995 by The American Society of Mechanical Engineers
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