Forced Convective Cooling Enhancement Through a Double Layer Design

[+] Author and Article Information
B. T. F. Chung, H. H. Li

Department of Mechanical Engineering, The University of Akron, Akron, OH 44325-3903

J. Electron. Packag 117(1), 69-74 (Mar 01, 1995) (6 pages) doi:10.1115/1.2792069 History: Received March 22, 1993; Revised November 14, 1994; Online November 06, 2007


Numerical simulation of fluid flow and heat transfer during the cooling of electronic modules mounted on printed circuit boards are performed to examine the feasibility of a proposed double layer design. Conjugate solution of the two-dimensional energy equation is obtained for the incompressible flow over a number of uniformly heated blocks and the double layer board. Enhancement in heat convected from the modules along with the drop in maximum temperature of each module, obtained without increase in pressure head loss, characterizes the cooling improvement by the proposed design. Systematic calculations also provide sufficient data of the flow and temperature distributions for analyzing the cooling mechanism.

Copyright © 1995 by The American Society of Mechanical Engineers
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