Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices

[+] Author and Article Information
Pardeep K. Bhatti, Klaus Gschwend, Abel Y. Kwang, Ahmer R. Syed

Delco Electronics Corporation, GM Hughes Electronics, Kokomo, IN 46904

J. Electron. Packag 117(1), 20-25 (Mar 01, 1995) (6 pages) doi:10.1115/1.2792063 History: Revised December 01, 1994; Online November 06, 2007


Three-dimensional finite element analysis has been applied for determining time-dependent solder joint response of leaded surface mount components under thermal cycling. Two main challenges are the geometric complexity in mesh development and computationally intensive analysis because of the highly nonlinear material properties. Advanced techniques have been applied, including multi-point constraints for mesh transition, which reduces the number of degrees of freedom in the model, and substructuring, which effectively reduces computational time in the iterative analysis. The result is a generic approach for nonlinear creep analysis using commercial FEA software on a high performance workstation. Illustrations are provided for J and gullwing leaded packages.

Copyright © 1995 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In