Methodology for Automated Design of Microelectronic Packages

[+] Author and Article Information
S. D. Rajan

Department of Civil Engineering, Arizona State University, Tempe, AZ, 85287-5306

V. Sarihan, M. Mahalingam

APDC. Semiconductor Products Sector, Motorola, Tempe, AZ 85233

J. Electron. Packag 116(4), 274-281 (Dec 01, 1994) (8 pages) doi:10.1115/1.2905698 History: Received September 21, 1993; Revised May 19, 1994; Online April 28, 2008


A general design methodology for the optimal design of electronic packages is presented. The design problem is cast as a nonlinear programming (NLP) problem. Design for critical packaging issues such as thermal and mechanical performance, is automated by combining thermal and mechanical finite element analysis with an NLP optimizer. The major issues such as design problem formulation, model generation or preprocessing, nonlinear finite element analysis, design variable identification, design sensitivity analysis and software implementation are addressed. A case study involving the design of an RF packaging component in communication products illustrates the design methodology implemented in the Automated Design of Electronic Packaging (ADEP) software system.

Copyright © 1994 by The American Society of Mechanical Engineers
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