Advantages and Disadvantages of Thin Small Outline Packages (TSOP) With Copper Gull-Wing Leads

[+] Author and Article Information
John Lau, Steve Erasmus

Hewlett-Packard Company, 1501 Page Mill Road, Palo Alto, CA 94304

Suresh Golwalkar

Intel Corporation, 1900 Prairie City Rd., FM1-80, Folsom, CA 95630

J. Electron. Packag 116(3), 234-237 (Sep 01, 1994) (4 pages) doi:10.1115/1.2905691 History: Received October 01, 1993; Revised March 30, 1994; Online April 28, 2008


In this paper, the advantage of TSOP with copper leads is shown by comparing: (1) the calculated stress and strain in the solder joints with that of the TSOP with Alloy 42 lead frames (Lau et al., 1992), and (2) the experimental thermal life distribution with that of the TSOP with Alloy 42 leads (Lau et al., 1993). The disadvantage of TSOP with copper leads is shown by considering the technology limitations and manufacturing constraints.

Copyright © 1994 by The American Society of Mechanical Engineers
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