Influence of Polymer Viscoelasticity on a Bending Bilayer

[+] Author and Article Information
B. D. Harper

Department of Engineering Mechanics, The Ohio State University, Colombus, OH 43210

J. Electron. Packag 116(3), 191-197 (Sep 01, 1994) (7 pages) doi:10.1115/1.2905685 History: Received April 26, 1993; Revised February 03, 1994; Online April 28, 2008


The bending bilayer technique is commonly employed to provide an empirical assessment of the often significant thermal stresses that develop in thin polymer films used in microelectronic packaging. Polymers are known to exhibit time-dependent (viscoelastic) behavior that is greatly accelerated at elevated temperatures. The solution for a bilayer beam with a linear viscoelastic, thermorheologically simple film bonded to a linear elastic substrate is developed. A wide variety of assumed viscoelastic material properties are considered along with properties for several specific electronic polymers in order to illustrate the general effects of polymer viscoelasticity upon the thermal stress in a polymer film. Practical methods for deducing the relative significance of polymer viscoelasticity from empirical bending bilayer results are emphasized. Comparisons with experimental data for two polymides and one epoxy molding compound are also provided.

Copyright © 1994 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In