Bending and Twisting of 60Sn40Pb Solder Interconnects With Creep

[+] Author and Article Information
John H. Lau

Hewlett-Packard Company, 1501 Page Mill Road, Palo Alto, CA 94304

J. Electron. Packag 116(2), 154-157 (Jun 01, 1994) (4 pages) doi:10.1115/1.2905504 History: Received August 01, 1993; Online April 28, 2008


An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the actions of bending and twisting moments. Dimensionless interaction curves and charts which relate the variables, interconnect geometry, solder material properties, bending moment, twisting moment, curvature rate, and twist rate are also provided for engineering practice convenience.

Copyright © 1994 by The American Society of Mechanical Engineers
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