Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

[+] Author and Article Information
M. K. Schwiebert

Hewlett-Packard Company, Palo Alto, CA 94303

J. Electron. Packag 116(2), 89-91 (Jun 01, 1994) (3 pages) doi:10.1115/1.2905510 History: Received August 01, 1993; Online April 28, 2008


This study considers the influence of solder joint voiding and seating plane stability on the lead standoffs of surface mount technology (SMT) solder joints. A model is presented for approximating the reaction force generated by a gas-filled void in molten solder which is compressed under an SMT lead. Seating plane stability is defined with a simple model. The lead standoffs of a component with an unstable seating plane are sensitive to small forces. For some SMT components, the reaction force generated by compressed voids in molten solder can tilt or rock a component, resulting in lead standoffs much greater than the measured lead coplanarity.

Copyright © 1994 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In