Modeling the Effects of Mixed Flowing Gas (MFG) Corrosion and Stress Relaxation on Contact Interface Resistance

[+] Author and Article Information
Shrikar Bhagath, Michael G. Pecht

CALCE Electronic Packaging Research Center, University of Maryland, College Park, MD 20742

J. Electron. Packag 115(4), 404-409 (Dec 01, 1993) (6 pages) doi:10.1115/1.2909349 History: Received November 16, 1992; Revised August 27, 1993; Online April 28, 2008


This paper presents the development of an initial, “first-cut”, mathematical model for the prediction of electrical interface reliability trends. The model pertains to gold plated contacts subject to loss of normal force and environmental corrosion with time. Stress relaxation over time and temperature in the base metal of the contact is accounted for. Utilizing the results of Mixed Flowing Gas (MFG) tests, the model can be used to estimate the statistical contact resistance at a particular load (normal force), aging and operating temperature in the class II and III environments. An attempt is made to correlate experimental data with the classical Holm’s equation and to introduce time dependence into the equation. Further work is proposed to correlate results with experimental connector performance data.

Copyright © 1993 by The American Society of Mechanical Engineers
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