Debonding in Overmolded Integrated Circuit Packages

[+] Author and Article Information
S. Hunt

Advanced Manufacturing Technologies, Motorola, Inc., 8000 West Sunrise Blvd., Ft. Lauderdale, FL 33322

L. A. Carlsson

Department of Mechanical Engineering, Florida Atlantic University, Boca Raton, FL 33431

J. Electron. Packag 115(3), 249-255 (Sep 01, 1993) (7 pages) doi:10.1115/1.2909325 History: Received April 14, 1992; Revised June 02, 1993; Online April 28, 2008


Recently introduced overmolded pad array chip carrier (OMPAC) electronic packages sometimes suffer from debonding between the overmold material and the printed circuit board. In this study, bond strength is characterized by a combination of experimental and analytical methods. Test specimens representative for OMPAC structures were designed, manufactured, and tested to failure in tension and torsion. Finite element stress analysis of the specimens was performed in conjunction with a combined interfacial stress failure criterion to determine interfacial tensile and shear strengths from the measured failure loads.

Copyright © 1993 by The American Society of Mechanical Engineers
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