An Approximate Thermal Contact Conductance Correlation

[+] Author and Article Information
V. W. Antonetti

Department of Mechanical Engineering, Manhattan College, Riverdale, N.Y.

T. D. Whittle

New York Power Authority, Buchanan, N.Y.

R. E. Simons

Advanced Thermal Laboratory, International Business Machine Corporation, Poughkeepsie, N.Y.

J. Electron. Packag 115(1), 131-134 (Mar 01, 1993) (4 pages) doi:10.1115/1.2909293 History: Received April 15, 1991; Revised September 07, 1992; Online April 28, 2008


An approximate thermal contact conductance correlation which does not depend upon the surface asperity slope was developed. Published surface texture data for 65 specimens were used to establish a relationship between the average roughness and the RMS asperity slope, which was then used to develop a new approximate thermal contact conductance correlation. The investigation was conducted for a range of surface roughness typical of contacting surfaces. Comparison to limited test data and to 2080 simulated contact joints, indicates the new approximate thermal contact conductance correlation has an expected RMS error of approximately 23 percent.

Copyright © 1993 by The American Society of Mechanical Engineers
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