Thermal Characterization of Heat Sink Adhesive Systems for Spacecraft Electronics by Time-Resolved Infrared Radiometry

[+] Author and Article Information
J. W. M. Spicer, M. G. Bevan, W. D. Kerns, H. S. Feldmesser

The Johns Hopkins University, Applied Physics Laboratory, Laurel, Maryland 20723

J. Electron. Packag 115(1), 101-105 (Mar 01, 1993) (5 pages) doi:10.1115/1.2909287 History: Received August 16, 1992; Revised October 20, 1992; Online April 28, 2008


A new thermal characterization technique, time-resolved infrared radiometry (TRIR), is used to investigate three different heat sink adhesive systems used in spacecraft electronics - a filled epoxy, a filled silicone and a tape adhesive. Measurements of heat sink efficiency are presented as a function of thermal cycling and the TRIR results are compared with ultrasonic and X-ray imaging techniques and with destructive analysis. The TRIR technique is shown to provide a measure of the relative heat sink capabilities of the different systems and can detect subsurface delamination in the filled epoxy system resulting from the development of cracks due to thermal cycling.

Copyright © 1993 by The American Society of Mechanical Engineers
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