Application of Impedance Spectroscopy for On-Line Monitoring of Solder Paste

[+] Author and Article Information
C. R. Herman, V. A. Skormin

Binghamton University, Binghamton, NY 13902

G. R. Westby

Universal Instruments Co., Binghamton, NY 13902

J. Electron. Packag 115(1), 44-54 (Mar 01, 1993) (11 pages) doi:10.1115/1.2909301 History: Received September 20, 1991; Revised December 27, 1992; Online April 28, 2008


The technique of impedance spectroscopy is suggested for industrial monitoring of solder paste in the surface mount assembly process. Being an on-line implementable technique, it has the potential of giving valuable insight to the manufacturing characteristics of solder paste and can facilitate application of statistical process control methods. This exploratory study evaluates impedance spectroscopy as a monitoring tool and focuses on key topics which can lead to the creation of on-line standards for solder paste. The presented technique is supported by experimental results and statistical analysis.

Copyright © 1993 by The American Society of Mechanical Engineers
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