Modeling Thermal Stresses in Periodic Structures: Some Observations Regarding the Boundary Conditions

[+] Author and Article Information
A. O. Cifuentes, S. R. Stiffler

IBM T. J. Watson Research Center, Yorktown Heights, New York 10598

J. Electron. Packag 114(4), 397-402 (Dec 01, 1992) (6 pages) doi:10.1115/1.2905471 History: Received April 19, 1992; Revised September 17, 1992; Online April 28, 2008


Periodic structures, that is, structures that consist of a basic pattern which is repeated multiple times, are commonplace in the electronics industry. This paper is concerned with the determination of thermal stresses in such structures. Specifically, it is demonstrated that thermal stresses can be computed using a reduced model, if one uses the correct boundary conditions. It is also shown that a reduced model can give very misleading results if incorrect boundary conditions are employed.

Copyright © 1992 by The American Society of Mechanical Engineers
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