Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules

[+] Author and Article Information
A. Hadim

Department of Mechanical Engineering, Stevens Institute of Technology, Hoboken, NJ

N. J. Nagurny

General Electric Government, Electronic Systems Division, Moorestown, NJ 08057

J. Electron. Packag 114(3), 300-304 (Sep 01, 1992) (5 pages) doi:10.1115/1.2905454 History: Received May 25, 1991; Revised April 15, 1992; Online April 28, 2008


Parametric studies are performed on heat transfer in surface-mounted components of conduction cooled Standard Electronic Modules (SEMs). Thermal network models are developed for the various components that are used in the SEMs. The models are validated by comparing the results with available experimental results from various test modules. An interfacing software package for thermal analysis (IN-STAN) is used to generate the thermal network representations of the models and a thermal network analyzer is used to perform the analysis. Several studies are performed to analyze the effects of important thermal design parameters including: chip and carrier size, cavity floor thickness, air gap thickness, die and carrier materials, and solder material.

Copyright © 1992 by The American Society of Mechanical Engineers
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