Isothermal Fatigue of LCC/PWB Interconnections

[+] Author and Article Information
H. D. Solomon

GE Corporate R&D Center, Schenectady, NY 12301

J. Electron. Packag 114(2), 161-168 (Jun 01, 1992) (8 pages) doi:10.1115/1.2906413 History: Received August 01, 1991; Online April 28, 2008


This paper describes the isothermal fatigue of leaded chip carrier to PWB interconnections. A split board technique was used to test the behavior of the Kovar leads and Sn63 solder joints made between a 64 IO leaded chip carrier and a PWB. The leads and solder joints were subjected to proscribed deflections at 35°C or 125°C and at frequencies of 0.33 Hz or about 0.002 Hz. At 35°C and 0.33 Hz, the failures were primarily in the Kovar lead, but when the cycling frequency was decreased to about 0.002 Hz, the failures developed in the Sn63 solder joint between the lead and the PWB. At 125°C, the failures were in the solder, even when the cycling frequency was 0.33 Hz. In addition to studying the influence of temperature and cycle frequency, this paper also compares the behavior of leaded joints to that of leadless joints and illustrates the superiority of the leaded joints.

Copyright © 1992 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In