Wetting Dynamics of Molten Solder Alloys on Metal Substrates

[+] Author and Article Information
T. J. Singler, J. A. Clum

Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, NY 13902-4000

E. R. Prack

Corporate Manufacturing Research Center, Motorola, Inc., Schaumburg, Ill 60196

J. Electron. Packag 114(2), 128-134 (Jun 01, 1992) (7 pages) doi:10.1115/1.2906409 History: Received August 01, 1991; Online April 28, 2008


Preliminary results from solderability studies are used to elucidate the physicochemical aspects of solderability, in particular the relationship between liquid composition and wetting. Spreading front morphology is discussed and a possible mechanism for observed rapid spreading sequences is advanced. That mechanism is based on solubility of metallization in one of the solder components (Sn). A composition study of a spreading sequence exhibiting a precursor film is presented along with a discussion of the role of the film in the overall wetting process. Segregation of the Pb and Sn alloy components during the spreading is discussed in terms of surface energy concepts, and the microscopic features of the substrate.

Copyright © 1992 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In