Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process

[+] Author and Article Information
M. Eftychiou, T. L. Bergman, G. Y. Masada

Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas 78712

J. Electron. Packag 114(1), 48-54 (Mar 01, 1992) (7 pages) doi:10.1115/1.2905441 History: Received September 28, 1990; Revised November 08, 1991; Online April 28, 2008


A numerical model is developed that describes the infrared reflow soldering of surface mounted components onto prewired circuit cards. The model predicts convective conditions within the reflow oven and uses these conditions, in conjunction with a radiative heat transfer analysis and a two-dimensional transient conduction analysis, to predict the thermal response of a card assembly as its components are soldered. The model is described, and its performance is illustrated through presentation of base case simulations. Parametric simulations are performed to determine the sensitivity of the card assembly thermal response to variations in oven conditions and uncertainties in the convective, as well as radiative heat transfer portions of the model.

Copyright © 1992 by The American Society of Mechanical Engineers
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