Heat Transfer Enhancement by Flow Destabilization in Electronic Chip Configurations

[+] Author and Article Information
C. H. Amon

Carnegie Mellon University, Department of Mechanical Engineering, Pittsburgh, PA 15213

J. Electron. Packag 114(1), 35-40 (Mar 01, 1992) (6 pages) doi:10.1115/1.2905439 History: Received May 13, 1991; Revised October 01, 1991; Online April 28, 2008


Numerical simulations of the flow pattern and forced convective heat transfer in geometries such as those encountered in cooling systems for electronic devices are presented. For Reynolds numbers above the critical one, Rc , these flows exhibit a traveling wave structure with laminar self-sustained oscillations at the least stable Tollmien-Schlichting mode frequency. Supercritical oscillatory flow induces large-scale convective patterns which lead to significant mixing and correspondingly heat transfer augmentation. Three techniques of heat transfer enhancement by flow destabilization are compared on an equal pumping basis: active flow modulation, passive flow modulation and supercritical flow destabilization. It is found that the best enhancement system regarding minimum power dissipation corresponds to passive flow modulation in the range of low Nusselt numbers. However, supercritical flow destabilization becomes competitive as the requirement for a higher Nusselt number begins to dominate the design choices.

Copyright © 1992 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In