Effects of Peeling Stresses in Bimaterial Assembly

[+] Author and Article Information
Ilya B. Mirman

Department of Mechanical Engineering, Stanford University, Stanford, CA 94305

J. Electron. Packag 113(4), 431-433 (Dec 01, 1991) (3 pages) doi:10.1115/1.2905433 History: Received June 06, 1991; Revised October 07, 1991; Online April 28, 2008


Peeling stress is experimentally shown to be an important factor for delamination in thermally mismatched bimaterial assembly. Strips of the plastic ULTEM-1000 and nickel alloy Kovar were attached with Devcon 14200 epoxy, and the temperature was raised from the stress-free curing temperature for one set of samples, and lowered for another set of samples, resulting in interfacial stresses. The samples that delaminated had the highest peeling stress.

Copyright © 1991 by The American Society of Mechanical Engineers
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