Natural Convection Cooling of a Horizontally Oriented Component Board Mounted in a Low-Aspect-Ratio Enclosure

[+] Author and Article Information
R. J. Krane

Department of Mechanical and Aerospace Engineering, The University of Tennessee, Knoxville, Tenn. 37996-2210

T. J. Phillips

PDA Engineering, Troy, Mich

J. Electron. Packag 113(3), 301-308 (Sep 01, 1991) (8 pages) doi:10.1115/1.2905410 History: Received January 01, 1990; Revised June 17, 1991; Online April 28, 2008


This investigation consisted of an experimental study of the natural convection heat transfer from a square, horizontally oriented electronic component board mounted in a low-aspect-ratio enclosure with a square planform. The component board was simulated by an upward-facing constant heat flux surface. A variety of experiments were performed to determine the effects of systematically varying the enclosure geometry on the maximum surface temperature on the board for two values of the modified Rayleigh number (heater power setting).

Copyright © 1991 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In